Ceramic Board
Thermal conductivity: 20–200 W/m·K (20–200 times that of aluminum-based copper-clad boards). Dielectric withstand voltage: 17,000 V/mm (17 times that of other circuit boards).
Conductor trace adhesion: ≥20 N/cm* (20 times that of other circuit boards). Surface roughness of the ceramic board: 0.2–0.7 μm.
Compressive strength: ≥450 MPa (higher than any PCB material). It also exhibits excellent electrical performance in various harsh environments (high temperature, high humidity, high pressure, high corrosion).